Part Number Hot Search : 
SLA7611 SL358N C3025 00AXI MBRA100 ACTQ973 ONTROL 1N944
Product Description
Full Text Search
 

To Download CS9202YDFR8G Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 CS9202 Micropower 3.3 V, 100 mA Linear Regulator with NOCAPt
The CS9202 is a precision 3.3 V, 100 mA voltage regulator with low quiescent current (450 mA typ @ 100 mA load). The 3.3 V output is accurate within 2% and supplies 100 mA of load current. The regulator is protected against reverse battery, short circuit, over voltage, and over temperature conditions. The device can withstand 74 V peak transients making it suitable for use in automotive environments. ON's proprietary NOCAP solution is the first technology which allows the output to be stable without the use of an external capacitor. NOCAP is suitable for slow switching or steady loads.
Features http://onsemi.com
8 1
* * * * *
* *
NOCAP Low Quiescent Current (450 m typ @ 100 mA load) 3.3 V, 2% Output 100 mA Output Current Capability Fault Protection - 74 V Peak Transient Voltage - -15 V Reverse Voltage - Short Circuit - Thermal Shutdown - Overvoltage Shutdown Internally Fused Leads Pb-Free Packages are Available
SOIC-8 DF SUFFIX CASE 751
PIN CONNECTIONS AND MARKING DIAGRAM
VOUT GND GND NC
1 CS920 ALYW2 G
8
VIN GND GND NC
VIN Over Voltage Shutdown Current Source (Circuit Bias) NOCAP Current Limit Sense
VOUT
CS9202 = Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb-Free Package
ORDERING INFORMATION
Device
Sense*
Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free)
Shipping 98 Units/Rail 98 Units/Rail 2500 Tape & Reel 2500 Tape & Reel
CS9202YDF8 CS9202YDF8G
+
- Error Amplifier
CS9202YDFR8
Thermal Shutdown
CS9202YDFR8G
Bandgap Reference
GND
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
*Contact factory for optional Sense lead.
Figure 1. Block Diagram
(c) Semiconductor Components Industries, LLC, 2006
1
June, 2006 - Rev. 14
Publication Order Number: CS9202/D
CS9202
MAXIMUM RATINGS
Parameter Power Dissipation Input Voltage (VIN): DC Peak Transient Voltage (60 V Load Dump @ VIN = 14 V) Output Current ESD Susceptibility (Human Body Model) Package Thermal Resistance: Junction-to-Case, RqJC Junction-to-Ambient, RqJA Junction Temperature Storage Temperature Lead Temperature Soldering: Reflow (SMD styles only) (Note 1) Value Internally Limited -15 to 36 74 Internally Limited 4.0 25 110 -40 to +150 -55 to +150 230 Peak Unit - V V - kV C/W C/W C C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 60 second maximum above 183C.
ELECTRICAL CHARACTERISTICS (4.5 V VIN 26 V, IOUT = 1.0 mA, -40C TJ 125C; unless otherwise stated.)
Parameter OUTPUT STAGE Output Voltage, VOUT Load Regulation Line Regulation Quiescent Current, (IQ) 9.0 V < VIN < 16 V, 100 mA IOUT 100 mA 4.5 V < VIN < 26 V, 100 mA IOUT 100 mA VIN = 14 V, 100 mA IOUT 100 mA 4.5 V < V < 26 V, IOUT = 1.0 mA IOUT = 100 mA, VIN = 12 V IOUT 50 mA IOUT 100 mA 7.0 V VIN 17 V, IOUT = 100 mA, f = 120 Hz - VOUT = 0 V - VOUT 1.0 V 3.234 3.201 - - - 3.300 3.300 5 5 450 4 12 75 200 125 180 32 3.366 3.399 50 50 750 6 20 - - - - 36 V V mV mV mA mA mA dB mA mA C V Test Conditions Min Typ Max Unit
Ripple Rejection Current Limit Short Circuit Output Current Thermal Shutdown (Note 2) Overvoltage Shutdown
60 105 25 150 28
2. This parameter is guaranteed by design, but not parametrically tested in production.
PACKAGE LEAD DESCRIPTION
Package Lead Number SOIC-8 1 2, 3, 6, 7 4, 5 8 Lead Symbol VOUT GND NC VIN Function 3.3 V, 2%, 100 mA output. Ground. No connection. Input voltage.
http://onsemi.com
2
CS9202
TYPICAL PERFORMANCE CHARACTERISTICS
14 12 Load Regulation (mV) 10 8 6 4 2 0 -2 0 10 20 30 40 50 60 70 Output Current (mA) 80 90 100 125C 25C -40C Output Voltage (V) 3.320 3.315 3.310 3.305 3.300 3.295 3.290 3.285 3.280 -40 -20 0 20 40 60 80 100 120 140 20 mA 100 mA 100 mA
Temperature (C)
Figure 2. Load Regulation vs. Output Current VIN = 14 V
8 6 Line Regulation (mV) 4 2 0 -2 -4 -6 -8 6 8 10 12 14 16 18 20 Input Voltage (V) 22 24 26 -40C 25C 125C Quiescent Current (mA)
Figure 3. Output Voltage vs. Temperature VIN = 14 V
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0 1 25C 125C
-40C 2 3 4 5 6 7 8 9 10
Output Current (mA)
Figure 4. Line Regulation vs. Input Voltage IOUT = 100 mA
12 10 Quiescent Current (mA) Quiescent Current (mA) 8 6 4 2 0 -40C 25C 125C 0.70 0.65 0.60 0.55 0.50 0.45 0.40
Figure 5. Quiescent Current vs. Output Current (Lightly Loaded) VIN = 14 V
-40C
125C
25C 0.35 0.30 4 6 8 10 12 14 16 18 Input Voltage (V) 20 22 24 26
0
10
20
30
40
50
60
70
80
90 100
Output Current (mA)
Figure 6. Quiescent Current vs. Output Current VIN = 14 V
Figure 7. Quiescent Current vs. Input Voltage IOUT = 100 mA
http://onsemi.com
3
CS9202
CIRCUIT DESCRIPTION VOLTAGE REFERENCE AND OUTPUT CIRCUITRY
Output Stage Protection
VIN VOUT
> 32 V
The output stage is protected against overvoltage, short circuit and thermal runaway conditions (Figure 8). If the input voltage rises above 32 V (typ), the output shuts down. This response protects the internal circuitry and enables the IC to survive unexpected voltage transients. Should the junction temperature of the power device exceed 180C (typ) the power transistor is turned off. Thermal shutdown is an effective means to prevent die overheating since the power transistor is the principle heat source in the IC.
IOUT
Load Dump
Short Circuit
Thermal Shutdown
Figure 8. Typical Circuit Waveforms for Output Stage Protection
VIN C1* 0.1 mF
VOUT
CS9202
GND
* C1 is required if regulator is distant from power source filter.
Figure 9. Application and Test Diagram
APPLICATION NOTES STABILITY CONSIDERATIONS / NOCAP Normally a linear regulator (with a slow lateral PNP in the control loop) necessitates a large external compensation capacitor at the output of the IC. The external capacitor is also used to curtail offshoot, determine startup delay time and load transient response. Traditional regulators typically have low unity gain bandwidth, display overshoot and poor ripple rejection. Compensation is also an issue and depends on the external capacitor value, ESR (Equivalent Series Resistance) and board layout parasitics that all can create oscillations if not properly accounted for. NOCAP is an ON Semiconductor exclusive output stage which internally compensates the regulator over temperature, load and line variations without the need for an expensive external capacitor. NOCAP is ideally suited for slow switching or steady loads. If the load is characterized by transient current events, an output storage capacitor may be needed. If this is the case, the capacitor should be no larger than 100 nF. With loads that require greater transient suppression, a regulator with a traditional output stage (such as the CS8221) may be better suited for proper operation.
http://onsemi.com
4
CS9202
CALCULATING POWER DISSIPATION IN A SINGLE OUTPUT LINEAR REGULATOR The maximum power dissipation for a single output regulator (Figure 10) is:
PD(max) + {VIN(max) * VOUT(min)} IOUT(max) ) VIN(max)IQ (1)
The value of RqJA can then be compared with those in the package section of the data sheet. Those packages with RqJA's less than the calculated value in equation 2 will keep the die temperature below 150C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heatsink will be required. HEAT SINKS A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA:
RqJA + RqJC ) RqCS ) RqSA
(3)
where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current for the application, and IQ is the quiescent current the regulator consumes at IOUT(max). Once the value of PD(max) is known, the maximum permissible value of RqJA can be calculated:
RqJA + 150C * TA PD
(2)
IIN VIN
where: RqJC = the junction-to-case thermal resistance, RqCS = the case-to-heatsink thermal resistance, and RqSA = the heatsink-to-ambient thermal resistance. RqJC appears in the package section of the data sheet. Like RqJA, it too is a function of package type. RqCS and RqSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heat sink manufacturers.
IOUT
CS9202
VOUT
IQ
Figure 10. Single output regulator with key performance parameters labeled.
http://onsemi.com
5
CS9202
PACKAGE DIMENSIONS
SOIC-8 NB CASE 751-07 ISSUE AH
-X- A
8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
NOCAP is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
6
CS9202/D


▲Up To Search▲   

 
Price & Availability of CS9202YDFR8G

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X